In the upcoming 5G era, with the development of electronic devices, driverless vehicles, and the expansion of IoT, MLCC will become even more important. Samsung Electric is capable of producing 600 laminated high-capacity MLCC with extremely high technical capabilities. To meet the market trend, Samsung Electric tries its best to develop miniature, ultra-high capacity products and high-tech intensive products with high reliability and high quality.
It plays the role of "dam" for quantitative transmission of electricity after storage, and regulates the quantitative transmission of current in the circuit to prevent electromagnetic interference between components. Samsung Electric is not only in smart phones, LED TV, PC and other IT devices, but also in the relatively high reliability requirements of the vehicle MLCC development, and is making continuous efforts.
view details >Smart phones and other digital devices in the core components, stable maintenance of chip and sensor supply voltage。
view details >Using properties that control DC and AC currents, reduce the voltage or hold the current constant within the circuit。
view details >Designed in the form of a chip, it can be applied to surface mount devices, which are capacitors that remove charge, discharge and noise.
view details >A product that provides photographing capabilities to electronic devices such as smartphones, tablets, etc.
view details >Based on IEEE802.11 technology, it realizes close distance according to various specifications A product of an infinite transmission and reception system for data transmission.
view details >Package substrate used in the core semiconductors of smart phones and PCs, It is a high-density embankment board capable of forming fine circuits.The corresponding substrate transmits electrical signals between the semiconductor and the motherboard.
view details >Substrate consisting of Rigid part (Rigid part) and soft part (Flex part). Through the outstanding bending, no need to connect the connector between the modules, conducive to miniaturization, lightweight, high design freedom.
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